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| PCBA capabilities | |
| Item | Manufacturing Capabilities |
| Assembly Types | Surface mount (SMT) Through-hole (DIP) Mixed technology (SMT & Thru-hole) Ball-Grid-Array (BGA) Assembly Mixed Assembly (Single & double sided placement) |
| Lead Time | From 24 hours to 7 days once all parts are prepared. |
| Quality Grade | IPC-A-610 |
| Max. Board Size | 500mm X 400mm |
| Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| Order Volume | 1 – 80000 pcs (For mass production orders, please get in touch with [email protected].) |
| Component Sourcing | Turnkey (All components sourced by QukoPCB) Partial turnkey Kitted/Consigned |
| Surface Finish | Lead/Lead-free HASL (RoHS compliant), Immersion gold, OPS, etc. |
| Min Package | Passive components as small as 01005 (0402) package |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| Stencil | Stencil with or without frame (offered free by QukoPCB) |
| SMT Capacity | 2 Million~4 Million Soldering Pad/day |
| DIP Capacity | 200 Thousand Pins/Day |
| Quality Inspection | Visual inspection AOI checking X-RAY checking, BGA placement Conformal coating Functional testing IC programming |
