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PCB capabilities | |||
| Item | Manufacturing Capabilities | Notes | |
| Layer count | 1 – 32 layers | The number of copper layers in the board. For Rogers, Aluminum, Flex, Rigid-flex, and HDI boards, please contact [email protected] for details. | |
| Impedance | For 4, 6, 8, 10, 12, 14, 16, 18, 20 layers PCB, default layer stack-up | QukoPCB Impedance Calculation（we will use professional software to calculate the impedance value and then provide professional suggestions to modify the track/spacing to meet the expected value ） | |
| Impedance Tolerance | ±10% | ||
| Material | FR-4 Aluminum/ Copper core Rogers PTFE Teflon/ CEM-1/ CEM-3/ Polyimide | FR-4: TG130~140/TG150~160/TG170~180 Aluminum thermal conductivity: 1.0W/1.5W/2.0W/3.0W/6.0W/8.0W Copper core thermal conductivity: 2.0W/3.0W | |
| Dielectric constant | 4.1- 4.5 | For more details, please get in touch with [email protected]. | |
| Max. dimension | 1-2 layers: 1200*300mm/500*600mm 4-20 layers: 400*500mm | The maximum dimension that QukoPCB can do. For mass production orders, please contact [email protected]. | |
| Min. dimension | 5*5mm | ||
| Dimension Tolerance | ±0.2mm | Precision CNC routing: ±0.1mm CNC routing : ±0.2mm V-scoring: ±0.4mm | |
| Board Thickness | 0.2/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.5/3.0/3.2mm | The thickness of the finished FR-4 board. | |
| Thickness tolerance ( Thickness≥1.0mm) | ±10% | e.g. For a board thickness of 1.5mm, the final board thickness can vary from 1.35mm (T-1.5×10%) to 1.65mm (T+1.5×10%). | |
| Thickness tolerance ( Thickness < 1.0mm) | ±0.1mm | e.g. For a board thickness of 1mm, the final board thickness can vary from 0.9mm (1-0.1) to 1.1mm (1+0.1). | |
| Outer Layer Copper Thickness | 1 oz/ 2 oz/ 3 oz (35μm/70μm/105μm) | The finished copper weight of the outer layer could be 1 oz/ 2 oz/ 3 oz | |
| Inner Layer Copper Thickness | 0.5 oz / 1 oz / 1.5 oz/ 2 oz (17.5um / 35um / 50μm/ 70um) | The finished copper weight of the inner layer could be 0.5 oz / 1 oz / 1.5 oz/ 2 oz | |
| Surface finish | HASL lead-free, HASL with lead, ENIG, OSP Hard Gold, ENEPIG, Immersion silver(Ag) , Immersion tin | / | |
| Electrical test | Flying Probe Special test fixture | There are no limits for Flying Probe testing. A PCB test fixture can test up to 14,000 pads. | |
| Special Specification | Impedance control Custom Layer Stackup Interstitial Via Hole(IVH) Via in pad Via filled with resin Countersinks/Counterbores Carbon Mask Halogen-Free Z-axis milling Edge Plating Others | For more details, please contact [email protected]. | |
Drill/Hole Size | |||
| Item | Manufacturing Capabilities | Notes | |
| Drill Hole Size | 0.15-6.5mm | Min. drill hole size: 0.15mm(available for PCB thickness ≤ 1.2mm) Max. diameter of drilling bits is 6.5mm (contact [email protected] if your customed hole size > 6.5mm) | |
| Drill Hole Size Tolerance | +0.13/-0.08mm ≤0.05mm (Precision) | For a hole size of 0.5mm, the acceptable finished hole size ranges from 0.42mm to 0.63mm. For precision needs, QukoPCB can do less than 0.05mm.s | |
| Blind/Buried vias | Mechanical blind buried vias: copper thickness of blind vias ≥ 20µm
Laser blind buried vias: dimple ≤ 10µm | ||
| Via pad size | ≥0.1 | The pad hole size will be enlarged by 0.125mm in production. If you have problems with it, please get in touch with [email protected]. | |
| PTH hole size | 0.2mm | The annular ring size will be enlarged to 0.15mm/ 0.2mm in production | |
| Min. Non-plated holes | 0.4mm | / | |
| Min. plated slots | 0.5mm | / | |
| Min. non-plated slots | 0.5mm | ||
| NPTH to Copper Line | ≥0.2mm | / | |
| Min. castellated holes | 0.5mm | The minimum diameter of castellated holes is 0.50mm | |
| Hole size tolerance(Plated) | +0.13mm/-0.08mm ±0.075mm (Precision) | e.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable. For precision needs, QukoPCB can do ±0.075mm. | |
| Hole size Tolerance(Non-Plated) | ±0.2mm ±0.05mm (Precision) | e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable. For precision needs, QukoPCB can do ±0.05mm. | |
| Rectangle hole/Slot | With or without fillet angle | ||
Minimum Annular Ring Size | |||
| Item | Manufacturing Capabilities | Notes | |
| 1 oz Copper | 0.09mm | ≈3.5mil (single side) | |
| 2 oz Copper | 0.11mm | ≈4.5mil (single side) | |
Minimum Clearance | |||
| Item | Capabilities | Notes | |
| Hole to hole clearance(Different nets) | 0.30mm | ≥12mil(Avoid conductive anodic filament) | |
| Via to Via clearance(Same nets) | 0.20mm | ≥8mil | |
| SMD pad to SMD pad clearance (Pad without hole, different nets) | ≥0.15mm | ||
| Pad to pad clearance (Pad with hole, different nets) | ≥0.4mm | ||
| Via to track | 0.18mm | ≥7mil | |
| PTH to track | 0.23mm | ≥9mil | |
| NPTH to track | 0.20mm | ≥8mil | |
| SMD pad to track | 0.10mm | ≥4mil | |
Minimum Track Width and Spacing | |||
| Copper weight | Min. trace width | Min. spacing | |
| 0.5oz Inner layer | 2.5mil (≈0.06mm) | 3mil (≈0.08mm) | |
| 1 oz(Outer layer) | 3mil (≈0.08mm) | 3mil ≈(0.08mm) | |
| 2 oz(Outer layer) | 5.5mil (≈0.14mm) | 5.5mil (≈0.14mm) | |
BGA | |||
| Layer count | Min. BGA pad dimensions | Min. distance between BGA | |
| 1 oz | ≥0.2mm | ≥0.12mm | |
Solder Mask | |||
| Item | Capabilities | Notes | |
| Soldermask Expansion | ≥0.038mm | 2 Layer: Expansion ≥ 0.038 mm per side; Edge of opening to adjacent traces ≥ 0.05 mm. Multilayer: No expansion required. A minimum solder mask opening of 1.5 mils around the pad must accommodate potential misregistration. | |
| Solder bridge | Green: 3.5mil Black/White: 5mil other solder mask: 4mil | To build solder bridge, the spacing between the copper pad edge must be 3.5mils or more | |
| Solder mask color | Green/Red/Yellow/Blue/White/ Matte Black/Black/Purple | ||
| Solder mask dielectric constant | 3.5 | ||
| Solder mask thickness | 0.6mil- 0.8mil | ||
Legend | |||
| Item | Capabilities | Notes | |
| Minimum line width | Silkscreen printing≥5mil (5mil≈0.12mm) Printer printing≥3mil (3mil≈0.08mm) | Characters height less than 3 mil(0.076mm) will be unidentifiable. | |
| Minimum text height | Silkscreen printing≥30mil (30mil≈0.76mm) Printer printing≥24mil (24mil≈0.61mm) | Characters height less than 24 mil(0.61mm) will be unidentifiable. | |
| Character width-to-height ratio | ≥ 6:1 | The preferred ratio of width to height is 6:1 | |
| Pad to silkscreen | >6mil (6mil≈0.15mm) | The Minimum Distance Between the Pad and the Silkscreen is 0.15mm. | |
| Legend color | white/black | ||
Board Outlines | |||
| Item | Capabilities | Notes | |
| Trace to outline | ≥0.2mm | Individual board(Rounting): Trace to Outline ≥ 0.2mm | |
| Trace to V-cut line | ≥0.4mm | Panel board with V-scoring: Trace to V-cut line ≥0.4mm | |
Panelization | |||
| Item | Capabilities | Notes | |
| Panelization without space | 0mm | The space between PCB boards is 0mm. | |
| Panelization with space | ≥1.6mm | The space between panelized PCBs should be at least 1.6mm. If this requirement is not met, the routing process may become difficult and inefficient. | |
| Panelized round board | ≥20mmx20mm | The size of a single round board should be at least 20mm x 20mm. Panelize the boards with stamp holes and add tooling strips to all four edges. | |
| Panelized castellated holes board | Panelize with stamp holes and add tooling strips on four board edges | The distance between a castellated hole and the board corner should be greater than 2mm. The recommended diameter for a stamp hole is between 0.5mm and 0.8mm. The recommended distance between two stamp holes is between 0.2mm and 0.3mm. | |
| Min. width of breakaway tab | ≥4mm | The minimum width of a breakaway tab is 4mm. For breakaway tabs with mouse bites, the minimum width is 5mm. | |
| Min. edge rails | ≥3mm | If you choose panelization by QukoPCB, we will add 5mm edge rails on both sides by default. | |
