PCBA capabilities | |
Item | Manufacturing Capabilities |
Assembly Types | Surface mount (SMT) Through-hole (DIP) Mixed technology (SMT & Thru-hole) Ball-Grid-Array (BGA) Assembly Mixed Assembly (Single & double sided placement) |
Lead Time | From 24 hours to 7 days once all parts are prepared. |
Quality Grade | IPC-A-610 |
Max. Board Size | 500mm X 400mm |
Board Type | Rigid PCB, Flexible PCB, metal core PCB |
Order Volume | 1 – 1000 pcs (For mass production orders, please get in touch with service@QukoPCB.com.) |
Component Sourcing | Turnkey (All components sourced by QukoPCB) Partial turnkey Kitted/Consigned |
Surface Finish | Lead/Lead-free HASL (RoHS compliant), Immersion gold, OPS, etc. |
Min Package | Passive components as small as 01005 (0402) package |
Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
Stencil | Stencil with or without frame (offered free by QukoPCB) |
SMT Capacity | 2 Million~4 Million Soldering Pad/day |
DIP Capacity | 200 Thousand Pins/Day |
Quality Inspection | Visual inspection AOI checking X-RAY checking, BGA placement Conformal coating Functional testing IC programming |
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